Smart Card Manufacturing
built to keep your business running smoothly & securely
Smart Card Manufacturing Process
Our data center services offer reliable, secure and scalable infrastructure solutions tailored to your business needs.
We operate state-of-the-art facilities equipped with advanced technology to ensure optimal performance and minimal downtime.
Our full stack of services gives you the flexibility and peace of mind needed to support mission-critical operations.
Semiconductor Packaging Process
We have established Smart Card manufacturing facilities in the Middle East, Africa and Asia.
The products and services offered by these facilities cover Telecom (GSM), Banking (Debit and Credit) and ID cards.
Complete end to end manufacturing management from factory setup to production, covering operating system loading, card personalization, card body manufacturing, milling and embedding solutions.
Die Bond + Cure
Input: Plated Lead frame on a 35mm reel.
Input: Diced wafers on carriers.
Output: 35mm reel.
Wire Bond
Input: 35mm reel
Output: 35mm reel
Encapsulation
Input: 35mm reel
Output: 35mm reel
Grind
Reel to Reel
May be required to fit the SIM card height specification
Test
Reel to Reel
There are personalisation options also here
Smart Card Manufacturing Process
We operate state-of-the-art facilities equipped with advanced technology to ensure optimal performance and minimal downtime.
Our full stack of services gives you the flexibility and peace of mind needed to support mission-critical operations.
Sand to Chip Process
